Corsair High-Density DDR3 Memory for AMD Socket AM3 platforms
New 8GB Dominator features B.E.M.P. support and distinctive AMD Green heatsink fins
21 December 2009 Source: www.corsair.com
The new 8GB kit (part number CMD8GX3M4A1333C7) is tuned for optimal performance in AMD Socket AM3 platforms, and is comprised of four matched 2GB DIMMs that operate at a frequency of 1333MHz with tight latency timings of 7-7-7-20. The modules also feature Corsair's unique DHX+ cooling technology and sport green heatsink fins and highlights for the ultimate AMD-compatible look. An Airflow fan with matching green highlights is also included.
"AMD Socket AM3 Phenom II platforms offer enthusiasts phenomenal performance and value for money. With the imminent release of Windows 7, this new 8GB memory kit is the perfect way to optimize your AMD PC for the best performance," stated John Beekley, Vice President of Technical Marketing at Corsair. "Windows 7 is highly efficient at using extra memory, enabling enthusiasts to run more demanding tasks and games, and run more concurrent applications without slowing down their PCs."
Corsair has recently produced a whitepaper detailing some of the performance gains that can be realized with memory configurations of 8GB and larger. The study demonstrated that the higher density memory took advantage of the improved memory handling in Windows 7, which resulted in substantial performance gains in system startup, shutdown, context switching and game loading.
The 1333MHz CAS 7 Dominator kit also supports AMD's Black Edition Memory Profiles (B.E.M.P), which allows for the aggressive latency settings to be automatically configured in Windows using the AMD OverDrive software utility.
About DHX+ Technology
Corsair's innovative DHX+ technology uses specially designed, high-quality heatsinks and a custom-designed PCB that allows both the front and rear of the memory ICs, and the printed circuit board itself, to be cooled. DHX+ technology also allows for the cooling fins to be removed, allowing for a range of modular cooling accessories including extended heatsink fins, the Corsair Cooling Hydro Series H30 water cooling block and Corsair Cooling Ice Series T30 sub-ambient cooling subsystem, which cools the memory up to 20°C below room temperature for maximum overclocking performance. DHX and DHX+ designs are covered by US Patent number 7,606,034.